Thermally Conductive KC™ low cost ceramic substrates produced by C-Component is the best state-of-the-art solution for transferring excess heat from electronic devices to a heat sink.
KC™ substrates based on aluminium oxide (Al2O3) are greatly surpass mica or silicon pads in thermal conductivity and dielectric strength and provide the best performance for electronic devices, regardless of their power.
KC™ substrates made from aluminium nitride (AlN) are noted for their
outstanding thermal conductivity, comparable to the conductivity of
beryllium oxide-based ceramics, which are potentially carcinogenic. They
are cheaper and safer than beryllia ceramics and exceed their price /
quality ratio.
С-Component manufactures substrates for thick-film and thin-film chip resistors, chip inductors and absorbers
S-Component manufactures substrates based on aluminum nitride (AlN), providing the lowest prices and delivery times with consistently high quality
Making the widest range of products often requires the implementation of individual structural elements made of ceramic that has high wear resistance, durability, radiation resistance
C-Component manufactures ceramic substrates, panels, and single parts for hybrid integrated circuits, sensors, and other thick-film products.
C-Component manufactures custom ceramic substrates for thin-film applications providing Customers with required surface smoothness, thickness tolerance and flatness.
