Thick Film Substrates

C-Component manufactures ceramic substrates, panels, and single parts for hybrid integrated circuits, sensors, and other thick-film products. We meet our Customers' requirements and offer highly competitive solutions tailored to your application.

Technical Capabilities
  • Precision laser machining & scribing, hole drilling, profiling;
  • Surface and edge finishing;
  • Special requirements.

Also see

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Ceramic substrates for chip resistors

С-Component manufactures substrates for thick-film and thin-film chip resistors, chip inductors and absorbers

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Aluminum nitride (AlN) ceramic substrates

S-Component manufactures substrates based on aluminum nitride (AlN), providing the lowest prices and delivery times with consistently high quality

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Spacers, inserts, holders, and other profiled components

Making the widest range of products often requires the implementation of individual structural elements made of ceramic that has high wear resistance, durability, radiation resistance

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Thermally Conductive Insulating Plates and Washers

Thermally conductive ceramic substrates KS are the best solution for removing heat from electronic devices in standard housings such as TO, etc.

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Thin Film Substrates

C-Component manufactures custom ceramic substrates for thin-film applications providing Customers with required surface smoothness, thickness tolerance and flatness.

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