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+7 (495) 663-93-17

 
  zakaz@c-component.ru


Main Technologies

Technologies

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Laser processing and dicing
  • Laser cutting, scribing and hole stitching
  • Laser ablation
  • Disc cutting and profiling
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Metallization
  • Thin Film Technology
  • Thick Film Technology
  • DBC Technology
  • AMB Technology
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Assembly and installation
  • Assembling Products
  • Installation of products
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Lapping and polishing
  • Product grinding
  • Product polishing