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+7 (495) 663-93-17

 
  zakaz@c-component.ru


Main Technologies

Lapping and polishing

Application
Materials Used

Also see

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Laser processing and dicing

  • Laser cutting, scribing and hole stitching
  • Laser ablation
  • Disc cutting and profiling

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Metallization

  • Thin Film Technology
  • Thick Film Technology
  • DBC Technology
  • AMB Technology

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Assembly and installation

  • Assembling Products
  • Installation of products

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