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+7 (495) 663-93-17

 
  zakaz@c-component.ru


Main Technologies

Laser processing and dicing

Also see

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Metallization

  • Thin Film Technology
  • Thick Film Technology
  • DBC Technology
  • AMB Technology

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Assembly and installation

  • Assembling Products
  • Installation of products

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Lapping and polishing

  • Product grinding
  • Product polishing

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